| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the strength of a unit and to improve an internal insulation performance when a high frequency lighting circuit substrate for a fluorescent lamp is built in and thinned. <P>SOLUTION: The high frequency lighting device for the fluorescent lamp includes an upper case 2 having a pair of conductive connection blades 1, 1 on an upper surface, a lower case 3 coupled to this upper case 2, and the high frequency lighting circuit substrate (hereinafter merely called "a lighting circuit substrate) 4 for the fluorescent lamp contained in the space surrounded by the upper case 2 and the lower case 3 and electrically connected from the connection blades 1, 1. The upper case 2 has a first insulating panel 5 exposed to the upper surface, a second insulating panel 6 disposed on the lower surface of the first insulating panel 5, and a metal plate 7 sandwiched between the first insulating panel 5 and the second insulating panel 6. The lighting circuit substrate 4 is disposed on the lower surface of the second insulating panel 6 and unitized. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
