| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board having fewer defective parts wherein insulating foundation substrate is exposed to a solder resist layer and having excellent electrical insulation reliability of the solder resist layer. SOLUTION: This method for manufacturing the wiring board comprises the steps of forming a first photosensitive resin layer 3a all over the upper surface of the insulating substrate 1 having a mounting region A in the central part of the upper surface wherein a plurality of connection pads 2a are formed, then so exposing that the part of the first photosensitive resin layer 3a located at the mounting region A is left as a non-exposed part N1, then forming a second photosensitive resin layer 3b all over the first photosensitive resin layer 3a, then so exposing that the parts of the first and the second photosensitive resin layers 3a, 3b located at the central part of the connection pads 2a are left as non-exposed parts N3, then so developing the first and the second photosensitive resin layers 3a, 3b that the non-exposed parts N3 on the connection pads 2a are removed, and then curing them to form a solder resist layer 3. COPYRIGHT: (C)2005,JPO&NCIPI
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