发明名称 DEVICE AND METHOD FOR PROCESSING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To solve the problem that, if ultraviolet light is directly radiated from the exterior of a processing container, the window material of an optical window will be expensive and will be restricted to the sapphire glass or the like of high hardness, when etching the natural oxide film on the surface of a substrate accommodated in the processing container using reactive gas, such as fluoric acid, and raising this etch rate by the radiation of ultraviolet light. SOLUTION: The substrate processing device is provided with: a processing container 2 which accommodates a substrate 1 to be processed; an optical window 6 provided in an opening 5 which leads to the inside of this processing container 2; laser beam irradiation means (15, 16) for irradiating the inside of the processing container 2 through this optical window 6; and a condenser lens 17 for condensing the radiated laser beam. While setting up a focal position Fp of the laser beam by the condenser lens 17 into the atmosphere inside the processing container 2, the laser beam irradiation means radiates the laser beam of an infrared region with the power density whereby the breakdown of the atmosphere of focal position Fp can be carried out. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005236073(A) 申请公布日期 2005.09.02
申请号 JP20040044013 申请日期 2004.02.20
申请人 SONY CORP 发明人 MURAMOTO JUNICHI
分类号 H01L21/302;H01L21/304;(IPC1-7):H01L21/304 主分类号 H01L21/302
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