| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board which has resistivity against bending stress such as warpage and in which peelability is improved in a circuit pattern and various electronic components installed in the circuit board. SOLUTION: The various electronic components are mounted on the rectangular circuit board 10 fitted to an electronic apparatus 1, and the circuit pattern 12 having conductivity on a surface is formed. A plurality of slanting ellipse holes 15 which are slantingly arranged with respect to the circuit board 10 are formed in the short-hand direction of the circuit board 10. Thus, bending in a vertical direction to the circuit board 10 is effectively set free, and damage to the circuit board 10 and the peeling of the circuit pattern 12 from the circuit board 10 can be prevented. COPYRIGHT: (C)2005,JPO&NCIPI
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