<p>A hot-melt silicone adhesive comprising: (A) an organopolysiloxane resin with a softening point in the range of 40 to 250°C; (B) an organopolysiloxane that at 25°C is liquid or in the state of a crude rubber, which contains in one molecule at least two alkenyl groups; (C) a composition selected from a mixture of (i) an organopolysiloxane that contains silicon-bonded hydrogen atoms and (ii) an organic silicon compound that contains a silicon-bonded alkoxy group; or (iii) an organopolysiloxane that contains silicon-bonded hydrogen atoms and a silicon-bonded alkoxy group; (D) a hydrosilylation catalyst; and (E) a hydrosilylation-reaction inhibitor, demonstrates good gap-filling ability during thermo-compressive bonding to adherends with high surface roughness, even at low pressures, and that provides strong adhesion to the adherend after cross-linking.</p>
申请公布号
WO2006104236(A1)
申请公布日期
2006.10.05
申请号
WO2006JP306996
申请日期
2006.03.27
申请人
DOW CORNING TORAY CO., LTD.;FUJISAWA, TOYOHIKO;USHIO, YOSHITO;SUTOH, MANABU;TANIGUCHI, YOSHINORI;NAKANISHI, KOJI
发明人
FUJISAWA, TOYOHIKO;USHIO, YOSHITO;SUTOH, MANABU;TANIGUCHI, YOSHINORI;NAKANISHI, KOJI