| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a boat loading table for improving the accuracy of wafer transfer, by automatically correcting the centering, inclination and height of a boat, for preventing contact with a furnace core tube, when inserting a boat into the furnace core tube, and for improving in-surface uniformity at wafer film formation. SOLUTION: Protrusions 6 and 7 are formed at the center of the top plate 3 and of the bottom plate 4 of a boat 2, and the positions of the protrusions 6 and 7 of the top plate 3 and the bottom plate 4 of the boat 2 are detected by a sensor 31, installed in a wafer transfer machine 30. A control unit 40 calculates the coordinates of the protrusions 6 and 7 of the top plate 3 and the bottom plate 4 of the boat 2, based on the output of the sensor 31, and displaces a boat loading table 8 to the driving part 15 of a boat loading table 8 so as to correct the position of the boat 2. COPYRIGHT: (C)2008,JPO&INPIT
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