发明名称 |
System and method for cooling electronic systems |
摘要 |
A cooling system for cooling a plurality of electronic components comprises a centralized source comprising at least one micro cooler configured to deliver a flow of a cooling medium and a plurality of baffles configured to redistribute the cooling medium over the electronic components. The electronic components are situated in an enclosure.
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申请公布号 |
US7345873(B2) |
申请公布日期 |
2008.03.18 |
申请号 |
US20040953755 |
申请日期 |
2004.09.29 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
DEY SUBHRAJIT (NMN);MOELEKER PETRUS JOANNES JOSEPH;BALAN CHELLAPPA (NMN) |
分类号 |
H05K7/20;A47B77/08;H01L23/34;H05K5/00 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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