发明名称 System and method for cooling electronic systems
摘要 A cooling system for cooling a plurality of electronic components comprises a centralized source comprising at least one micro cooler configured to deliver a flow of a cooling medium and a plurality of baffles configured to redistribute the cooling medium over the electronic components. The electronic components are situated in an enclosure.
申请公布号 US7345873(B2) 申请公布日期 2008.03.18
申请号 US20040953755 申请日期 2004.09.29
申请人 GENERAL ELECTRIC COMPANY 发明人 DEY SUBHRAJIT (NMN);MOELEKER PETRUS JOANNES JOSEPH;BALAN CHELLAPPA (NMN)
分类号 H05K7/20;A47B77/08;H01L23/34;H05K5/00 主分类号 H05K7/20
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