| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To solve a problem in a conventional semiconductor module that using an insulating substrate or a wiring layer formed on the insulating substrate causes cost increase. <P>SOLUTION: A first semiconductor element having a junction electrode to be connected to a first node of a bidirectional switch circuit is mounted on a first metal base plate as a thermal diffusion plate. A second semiconductor element having a junction electrode to be connected to a second node of the bidirectional switch circuit is mounted on a second metal base plate as a thermal diffusion plate. The junction electrode of the first semiconductor element is set to have the same potential as the first metal base plate, and the junction electrode of the second semiconductor element is set to have the same potential as the second metal base plate. The metal bases and the nonjunction electrodes of the semiconductor elements are connected each other by thin metal wires to form the bidirectional switch circuit. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
