发明名称 ENHANCEMENT OF THERMAL INTERFACE CONDUCTIVITIES WITH CARBON NANOTUBE ARRAYS
摘要 A method of forming a well-anchored carbon nanotube (CNT) array, as well as thermal interfaces that make use of CNT arrays to provide very high thermal contact conductance. A thermal interface is formed between two bodies by depositing a continuous array of carbon nanotubes on a first of the bodies so that, on mating the bodies, the continuous array is between surface portions of the first and second bodies. The thermal interface preferably includes a multilayer anchoring structure that promotes anchoring of the continuous array of carbon nanotubes to the first body. The anchoring structure includes a titanium bond layer contacting the surface portion of the first body, and an outermost layer with nickel or iron catalytic particles from which the continuous array of carbon nanotubes are nucleated and grown. Additional thermal interface materials (TIM's) can be used in combination with the continuous array of carbon nanotubes.
申请公布号 WO2008051184(A3) 申请公布日期 2008.09.25
申请号 WO2006US30613 申请日期 2006.08.05
申请人 PURDUE RESEARCH FOUNDATION;XU, JUN;FISHER, TIMOTHY, S. 发明人 XU, JUN;FISHER, TIMOTHY, S.
分类号 H01L23/373 主分类号 H01L23/373
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