发明名称 METHOD AND APPARATUS FOR INSPECTING IC PART CONNECTING PART
摘要 <P>PROBLEM TO BE SOLVED: To provide an IC part inspection apparatus capable of verifying operations in a loaded state without breaking IC chips or electrodes. <P>SOLUTION: The IC part inspection apparatus communicates with reader/writer 32 via an antenna part 31 while an ultrasonic oscillator 41 loads vibrations on a strap substrate 22 to which an IC chip 23 is connected via electrodes 24a and 24b. The state of connection between the IC chip 23 and the strap substrate 22 is judged on the basis of the propriety of the communication. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008309518(A) 申请公布日期 2008.12.25
申请号 JP20070155240 申请日期 2007.06.12
申请人 OMRON CORP 发明人 YOSHIDA KAZUTAKA;KAWAI WAKAHIRO
分类号 G01R31/00;G01R31/04;G06K17/00 主分类号 G01R31/00
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