| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a rigid flex circuit board. SOLUTION: Mainly in a manufacturing step of a flexible printed board 1, a peelable protective layer is formed to protect a conductive circuit 201 which is on an exposed area 20 of the flexible printed board and resembles a golden finger. By manufacturing a circuit board in a hard-board reception area 10 of the flexible printed board, the rigid flex circuit board equipped with a peelable protective layer is formed. The component of the peelable protective layer includes epoxy resin and silicon rubber. Since it is formed in a manufacturing process under appropriate control, the peelable protective layer has such property as easily peeled with a hand. Further, it resists high temperature breakage and erosion with chemical agent during a succeeding manufacturing step such as for manufacturing a circuit board. COPYRIGHT: (C)2010,JPO&INPIT |
