发明名称 CIRCUIT BOARD
摘要 A circuit board comprises a first heat transfer structure made of a thermal conductive material and inserted into an insulation part. A cavity or a recess part is installed in the first heat transfer structure so that at least a portion of an electronic component is inserted into the first heat transfer structure. Therefore, the circuit board improves heat discharging performance.
申请公布号 KR20160057245(A) 申请公布日期 2016.05.23
申请号 KR20140158270 申请日期 2014.11.13
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 MIN, TAE HONG;KANG, MYUNG SAM;KO, YOUNG GWAN
分类号 H05K3/46;H05K1/02 主分类号 H05K3/46
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