System and method of forming semiconductor devices

摘要

Systems and methods including bonding two or more separately formed circuit layers are provided using, for example, cold welding techniques. Processing techniques may be provided for combining inorganic and/or organic semiconductor devices in apparatus including, for example, microchips, optoelectronic devices, such as solar cells, photodetectors and organic light emitting diodes (OLEDs), and other apparatus with multi-layer circuitry. Methods of bonding preformed circuit layers may include the use of stamping and pressure bonding contacts of two or more circuit layers together. Such methods may find applicability, for example, in bonding circuitry to shaped substrates, including various rounded and irregular shapes, and may be used to combine devices with different structural properties, e.g. from different materials systems.

主权项

1. An electrical circuit device comprising: a first circuit layer including a plurality of first contacts; a pre-formed layer including one or more semiconductor devices, the one or more semiconductor devices including a plurality of second contacts, wherein, the plurality of second contacts are directly bonded to the plurality of first contacts via a cold welded bond, wherein the first circuit layer is disposed on a non-developable surface, and a circuit sublayer under the first circuit layer and a photodiode material disposed between the circuit sub layer and the first circuit layer.