| 摘要 |
PROBLEM TO BE SOLVED: To provide a multi-chip semiconductor device wherein the manufacturing cost rise is suppressed, the plane area is small, and the structure is simple, and the thickness is small. SOLUTION: This multi-chip semiconductor device, mounting a plurality of semiconductor chips having elements integrated in a semiconductor substrate, is characterized in that the semiconductor chips 12-1 to 12-4 having identical structures in which connection plugs 4-1 to 4-7 formed in through-holes piercing the semiconductor substrate are laminated, the connection plugs of each chip are selectively connected via metal bumps 8-1 to 8-7, and the allotment of the addresses between chips is designated according to a connection pattern of the metal bumps. The chips having identical structures are laminated, hence this eliminates the need to manufacture a plurality of chip kinds having different structures and allows the same test to be conducted for all the chips, and since there is no need to consider the laminating order, the manufacturing cost can be reduced. |
