发明名称 Cleaning solution composition and method of cleaning semiconductor device using the same
摘要 A cleaning solution composition includes an organic solvent in which a metal fluoride does not dissolve, at least one fluoride compound that generates bifluoride (HF2−), and deionized water, wherein the deionized water may be included in a concentration of 1.5 wt % or lower based on the total weight of the cleaning solution composition.
申请公布号 US9394509(B2) 申请公布日期 2016.07.19
申请号 US201414542973 申请日期 2014.11.17
申请人 Samsung Electronics Co., Ltd. 发明人 Bae Sang-Won;Ko Yong-Sun;Kim Seok-Hoon;Kim In-Gi;Oh Jung-Min;Lee Kun-Tack;Lee Hyo-San;Jeong Ji-Hoon;Cho Yong-Jhin
分类号 H01L21/20;C11D11/00;H01L21/02;C11D7/08;C11D7/50;C11D7/10 主分类号 H01L21/20
代理机构 Myers Bigel & Sibley, P.A. 代理人 Myers Bigel & Sibley, P.A.
主权项 1. A cleaning solution composition, comprising: an organic solvent in which a metal fluoride does not dissolve; at least one fluoride compound that generates bifluoride (HF2−); and deionized water, wherein the deionized water is present in a concentration of 1.5 wt % or less based on the total weight of the cleaning solution composition, wherein the at least one fluoride compound includes hydrogen fluoride (HF) and ammonium fluoride (NH4F), and wherein the concentration of HF is in a range of 0.002 wt % to 0.01 wt % based on the total weight of the cleaning solution composition and the concentration of NH4F is in a range of 0.02 wt % to 0.05 wt % based on the total weight of the cleaning solution composition.
地址 KR
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