Micro-electromechanical reflector and method for manufacturing a micro-electromechanical reflector

摘要

A micro-electromechanical reflector is described including an electrode substrate having a first surface and a second surface, which is opposite to the first surface, on whose first surface a carrier layer is situated, a plurality of electrode recesses, which are introduced under the carrier layer from the first surface into the electrode substrate, a plurality of second electrode recesses, which are introduced from the second surface into the electrode substrate, at least one torsion spring structure which is formed in the carrier layer over one of the first electrode recesses, a carrier substrate, which is attached to the second surface of the electrode substrate, and a reflector surface, which is situated on the carrier layer.

主权项

1. A micro-electromechanical reflector, comprising:
an electrode substrate having a first surface and a second surface opposite to the first surface; a carrier layer situated on a first surface of the electrode substrate; a plurality of first electrode recesses located under the carrier layer from the first surface into the electrode substrate; a plurality of second electrode recesses introduced from a second surface of the electrode substrate into the electrode substrate; at least one torsion spring structure formed in the carrier layer over one of the first electrode recesses; a carrier substrate attached to the second surface of the electrode substrate; a reflector surface situated on the carrier layer; at least one first electrode movably mounted in the electrode substrate via the torsion spring structure; at least one second electrode mechanically fixedly anchored to at least one of the carrier substrate and the carrier layer, wherein the first electrode and the second electrode are formed by the first and second electrode recesses; at least one first comb structure; and at least one second comb structure, wherein:
the first comb structure and the second comb structure are formed by the second electrode recesses;the first comb structure is coupled to the first electrode and the second comb structure is coupled to the second electrode;the first and second comb structures include a plurality of comb elements that are interlocked in an electrode substrate plane and are situated spaced apart from one another and vertically in relation to the electrode substrate plane; andthe carrier substrate is connected to the electrode substrate via a metallic bonding material.