COMPONENT FOR PACKAGE, ELECTRONIC COMPONENT, AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a component for a package which enables an interior part of the package to be hermetically sealed in a secure manner and allows a user to easily check the joint state.SOLUTION: A component 2 for a package includes: a base substrate 11 and a lid substrate 12 which are joined in an overlapping manner; a cutout part 13 formed in a corner part of the base substrate 11; and a joint material 14 which is disposed so as to be arranged along the outer edge of the base substrate 11 when viewed in an overlapping direction of the base substrate 11 and the lid substrate 12 and is divided in a position corresponding to the cutout part 13.SELECTED DRAWING: Figure 2