| 摘要 |
<p>A process for forming a conductive coating on a substrate comprising (1) applying an electrically conductive material to the surface of an uncured or a partially cured organic resin having a tacky surface said resin being patterned circuitwise on a substrate and, thereafter, in either order, (2) curing said resin to fix the electrically conductive material in position on said surface by either heat or W radiation, preferably in an inert atmosphere, e. g., nitrogen, and (3) removing any loose electrically conductive material. This application is a continuation-in-part of copending application having Serial No. 215,780 filed December 12 1980, now abandoned.</p> |
