| 摘要 |
A decoupling capacitor and method of manufacture thereof are presented wherein the decoupling capacitor is formed in an in-line assembly and insert molding process. The decoupling capacitor is a hermetically sealed capacitive unit consisting of a ceramic chip, active leads and molded lugs for auto-insertion into printed circuit boards. The active leads and molded lugs are on the same height level to promote symmetry and ease of handling. |
