发明名称 Process for producing protective envelopes in which corresponding electric-electronic circuit components are dipped
摘要 The process comprises creating two conductor strips provided with end pieces whose external parts are bent on one and the same side, welding the electric-electronic components to the bent parts of corresponding end pieces, making a mold, inserting into the mold the unit constituted by the strips and the components, pouring liquid sealant into the mold in such a way as to cover the components but not the strips, with this condition being maintained until the sealant has set, separating the mold from the one piece block of sealant in which the components are dipped and from which project, at least partially, end pieces, removing the strips from the corresponding end pieces in order to define with these, the electrical terminations of the components, bending the terminations against the longitudinal sides of the one piece block and cutting the block along crosswise planes that do not effect the components.
申请公布号 US4720916(A) 申请公布日期 1988.01.26
申请号 US19860915877 申请日期 1986.10.08
申请人 ARCOTRONICS ITALIA S.P.A. 发明人 VENTURA, GIORGIO
分类号 H01C17/02;H01F41/12;H01G4/224;H01L21/00;H01L23/28;H01R4/22;H05K3/00;H05K7/00;(IPC1-7):H05K13/00 主分类号 H01C17/02
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