发明名称 RADIATION SENSITIVE RESIN COMPOSITION AND PATTERN FORMING METHOD USING SAME
摘要 PURPOSE:To obtain aptitude to exposure to radiation, especially, to ultraviolet rays and high sensitivity and superior storage stability and heat resistance by incorporating a compound to be allowed to generate an acid by irradiation with radiation and a polymer having specified structural units. CONSTITUTION:The radiation sensitive resin composition contains the compound to be allowed to generate an acid and the polymer having the structural units each represented by formula I in which R1 is H or methyl and (n) is 3 or 4. Proper compounds as the compound to be allowed to produce an acid, are as follows; (1) halogen of onium, such as salt of BF4<->, PF6<->, AsF6<->, SbF6<->, SiF6<->, ClO4<->, or CF3SO4<->, (2) an organic halogen compound, (3) naphthoquinonediazido-sulfonic acid, (4) a compound to be allowed to produce a sulfonic acid by irradiation with radiation, and the like. It is preferred to add this compound in an amount of 0.1 - 50wt.%, 0thus permitting the obtained composition to be high in sensitivity and superior in storage stability and heat resistance.
申请公布号 JPH0426850(A) 申请公布日期 1992.01.30
申请号 JP19900131238 申请日期 1990.05.23
申请人 TOUYOU GOUSEI KOUGIYOU KK 发明人 HAYASHI KEIICHI;KURATA NOBUYUKI;KIKUCHI HIDEO
分类号 G03F7/039;C08K3/16;C08K5/42;C08L33/04;C08L33/14;G03F7/38;H01L21/027 主分类号 G03F7/039
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