| 摘要 |
PROBLEM TO BE SOLVED: To provide a wire bonding device, which corrects effectively the positional deviation of an object to be processed, when bonding operation is stopped and improves the yield of the products. SOLUTION: A heater block 20 lowers and rises up again, when bonding operation is stopped and recovered. When the heater block 20 rises up again, the actual position of a bonding point (reference point) on the arbitrary lead of a lead frame 20 is detected by an image-pickup camera 5 and an image processor 6. In a control device 7, the positional deviation quantity of the reference point is computed, based on the actual position of the reference point after the detected heater block 20 has risen again and the actual position of the reference point when the bonding operation is started. Thereafter, when the bonding operation is restarted, while the bonding position is corrected based on the the positional deviation quantity at the bonding point on a pellet 21 and the lead frame 22 computed, when the bonding operation is started and the positional deviation quantity at the reference point when the bonding operation is stopped, a bonding head 1 is controlled. |
