Press-packed semiconductor device.

摘要

A common insulation plate is provided on a heat-discharging support member, and a plurality of press-packed semiconductor elements is provided on the common insulation plate. These semiconductor elements are coupled to electrodes which form a common electrode by a plurality of spring mechanisms. An internal connection terminal is slidably provided at each of the electrodes and is bent perpendicular to a pressing surface. Each of the internal connection terminals faces the adjacent one. After the electrodes are pressed against the respective semiconductor elements with adjustment, the internal connection terminals are electrically coupled together.