| 发明名称 |
Lead free, tin-bismuth solder alloys |
| 摘要 |
The lead free alloy is a low solidus temperature, multi-component solder alloy containing at least about 50 weight percent Bi, up to about 50 weight percent Sn (basis total Sn and Bi), and an effective amount of a physical and mechanical property enhancing third component. The third component can be Cu, In, Ag, and combinations of Cu and Ag. |
| 申请公布号 |
US5368814(A) |
申请公布日期 |
1994.11.29 |
| 申请号 |
US19930079064 |
申请日期 |
1993.06.16 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES, INC. |
发明人 |
GONYA, STEPHEN G.;LAKE, JAMES K.;LONG, RANDY C.;WILD, ROGER N. |
| 分类号 |
B23K35/26;C22C12/00;C22C13/02;C22C28/00;C22C30/00;H01L21/52;H05K3/34;(IPC1-7):C22C30/02 |
主分类号 |
B23K35/26 |
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