Heat-resisting plate having a cooling structure and method of manufacturing it

摘要

A heat-resisting plate employed in various devices that handle high temperature plasma or high energy particles, including a metallic substrate having a cooling structure wherein cooling pipes are embedded against the substrate by a thermal spray layer of the same material as the metallic substrate on one or both faces of the metallic substrate. In forming the heat-resisting plate, the metallic substrate is processed to the form of a plate, cooling pipes are arranged on one or both faces of this metallic substrate, and the cooling pipes are fixed by spraying a thermal spray layer on the face or faces of the metallic substrate where the cooling pipes are arranged, thereby to embed the cooling pipes between the thermal spray layer and the metallic substrate.