| 摘要 |
PURPOSE: To provide a semiconductor integrated circuit which can prevent the surface of each semiconductor chip from being damaged when assembling at least two semiconductor chips in a piece, facilitate their assembly without increasing the cost, and prevent the semiconductor chips from being displaced due to the inflow of sealing resin and its manufacturing method. CONSTITUTION: The side of a surface 11a of a semiconductor chip 11 with a larger surface dimension than that of a die pad part 1 is adhered to one surface of the die pad part 1 of a lead frame 10 while interposing an elastic insulation film 2 between them. While a reverse side 11b of the semiconductor chip 11 is in contact with a jig surface 60, wire is bonded to the semiconductor chip 11. While the lower surface of the die pad part 1 is in contact with a jig surface 55, the reverse side 12b of a semiconductor chip 12 is adhered to the reverse side 11b of the semiconductor chi 11 via adhesive 71. While the lower surface of the die pad part 1 is in contact with the jig surface 65, wire is bonded to the semiconductor chi 12. |
