| 摘要 |
PROBLEM TO BE SOLVED: To make the operating speed of a semiconductor device faster. SOLUTION: In a semiconductor device in which a pair of semiconductor chips 2 is mounted on a wiring board l, one end side of first lead wiring 5A electrically connected to an external terminal 3A for signal mounted on the main surface of one semiconductor chip 2 is positioned on the side face of the chip 2 and one end side of second lead wiring 5B electrically connected to an external terminal 3A for the external signal terminal mounted on the main surface of the other semiconductor chip 2 is arranged on the side face of the chip 2. Then the one end side of the wiring 5A is joined to the one end side of the wiring 5B between the side faces of the semiconductor chips 2. |
