A solder bump structure for electrically connecting a semiconductor chip to a package substrate comprises two layers formed on the chip 1 which is connected to an electrode 11 of a package substrate 10 in soldering. The lower layer 3a in the double-layer structure does not fuse in soldering, and a definite distance between the substrate and the chip can be secured. The upper layer 3b actually fuses in soldering and operates to electrically connect the bump to the electrode on the package substrate. The melting point of the lower layer is preferably at least 20 DEG C higher than that of the upper layer. <IMAGE>
