| 摘要 |
PROBLEM TO BE SOLVED: To obtain an adhesive having improved flame retardancy in spite of being a nonhalogen adhesive and improved in heat resistance, electrical properties, storage stability and high-temperature curability by including a specified sulfur-component-containing thermoplastic resin, an inorganic filler, an epoxy resin and an epoxy resin curing agent. SOLUTION: 30-90 wt.% sulfur-component-containing thermoplastic resin having a weight-average molecular weight of 10<3> -10<5> , 10-70 wt.% epoxy resin having an epoxy resin equivalent of 500 or below, 5-50 wt.%, based on component B, inorganic filler and an epoxy resin curing agent having a melting point of 130 deg.C or above are dissolved in a solvent such as acetone, methyl ethyl ketone, toluene or xylene to obtain an insulation adhesive for a multilayer printed wiring board. An interlayer-insulation-adhesive-coated copper foil obtained by applying the adhesive in a thickness of 15-120μm to the anchor surface of a copper foil and drying the adhesive at 80-130 deg.C is laminated on an inner layer circuit board by means of a dry film laminator, and the adhesive is cured to obtain a multilayer printed wiring board having an outer layer circuit. |
