| 摘要 |
PROBLEM TO BE SOLVED: To provide a positioning mark, which can be used in a semi-additive method, will not reduce the precision of alignment of a photomask film with a substrate and can be read, even if a photosensitive dry film is pressure-bonded to the mark, and to provide a method of manufacturing a multilayered printed wiring board using the mark. SOLUTION: Ring recessed parts 64 are formed in an inter-layer insulating layer 38, and a positioning mark 66 is formed by precipitating a copper electroless plated film 40 by an electroless plating. When the alignment of a photomask film 70 with a substrate 20 is performed, a difference between the quantity of reflection of the film 40, which comes into contact with a dry film 41, and the quantity of reflection of the film 40 located at the mark 66, which does not come into contact with the film 41, is read by a CCD camera 200 and the mark 66 is recognized as a ring mark. As the ring part of the mark 66 reflects light strongly, the outline of the ring of the ring part can be clearly identified. |
