发明名称 CUTTING METHOD AND DEVICE
摘要 PROBLEM TO BE SOLVED: To improve flatness precision of a thin plate at the time of cutting a bar type work piece such as ingot into the thin plate. SOLUTION: It is constituted of a cylindrical wire guide 3 to guide travelling of a wire by travelling and rotating the wire 2 and to apply tensile force on the wire 2, an ingot holding means 4 to hold ingot 1, a table 5 to vertically move the ingot 1 through the ingot holding means 4 so that the ingot 1 and the travelling wire 2 make contact with each other and pressurize each other, a movable type nozzle 7 to discharge an abrasive containing abrasive grains against the wire 2 and provided in the neighbourhood of the ingot 1 free to move and a control part 8 to control a position of the movable type nozzle 7 so that a distance between the ingot 1 and the movable type nozzle 7 becomes roughly constant in accordance with a cutting position in the diametrical direction on a cutting surface of the ingot 1.
申请公布号 JPH1199463(A) 申请公布日期 1999.04.13
申请号 JP19970262473 申请日期 1997.09.26
申请人 HITACHI LTD 发明人 YAMAMOTO SATORU;YAMAGUCHI AKIHISA;MATSUZAKI TORU
分类号 B24B27/06;B28D5/04;H01L21/304;(IPC1-7):B24B27/06 主分类号 B24B27/06
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