METHOD FOR MANAGING POLISHING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a method for managing a polishing apparatus so that it can polish wafers with high accuracy by reducing a variation in polishing arises in every wafer.

SOLUTION: The method for managing the polishing apparatus includes a device for detecting a load applied to a wafer to be polished. The method comprises a process of calculating a difference between a first load detected by the load detection device during a first time period for waiting for the polishing of the wafer and a second load detected by the device during a second time period when the wafer is polished, a process of calculating a real load value actually applied to the wafer during the second time period, and a process of monitoring the real load value.

COPYRIGHT: (C)2005,JPO&NCIPI