ELECTRONIC COMPONENT AND MANUFACTURE THEREOF

摘要

PROBLEM TO BE SOLVED: To reduce the occupying area of an electronic component on a board, when the component is mounted on the board and to facilitate the mounting work of the component on the board, and to enhance the reliability of soldering. SOLUTION: A plurality of resistors 18 are formed on a first surface of an insulating board 12 and a plurality of end-face electrodes 22, which are connected to their corresponding resistors 18, are provided on the second surface of the board 12 intersecting the first surface. Then a recessed section 20 is formed between each end-face electrode 22, and the widths of the forming surfaces of the resistors 18 are adjusted to <=3 times as broad as those of the forming surfaces of the end-face electrode 22.