| 摘要 |
<p>PROBLEM TO BE SOLVED: To enhance test efficiency of semiconductor wafers, by a method wherein a deformation of the semiconductor wafers can be corrected with advantageous costs and excellent efficiency. SOLUTION: A semiconductor wafer 1 is fetched out from a cassette 2 accommodating the semiconductor wafer 1 in which a circuit element is integrally produced by a conveyor 5, and is conveyed to a tester 3, and the tester 3 detects a deformation of the semiconductor wafer 1. Next, the semiconductor wafer 1 is transferred onto a stage 42 which can move respectively to an X direction and a Y direction by the conveyor 5, and when each circuit element is tested by a specified jig, in a state that the semiconductor wafer is mounted on the stage 42, a deformation of the semiconductor wafer 1 is corrected so that the jig and the semiconductor wafer 1 are set in specified position relationship. In this method, the stage 42 is moved to the X and Y direction according to detection results in the tester 3, whereby a deformation of the semiconductor wafer 1 is corrected.</p> |
