| 摘要 |
PROBLEM TO BE SOLVED: To simplify the manufacture process of a semiconductor device for surface mounting, which is provided with a projecting electrode, to improve yield and to reduce cost. SOLUTION: An insulating film 16 having an opening part 16a so that the peripheral edge part of an electrode pad 14 is coated and the inner side is exposed is formed on a semiconductor substrate 12 where an integrated circuit is provided. Projecting photosensitive resin 20 is formed on the electrode pad 14 so that an exposure part 14a where a part is not coated is left. A projecting electrode film 23 connected to the exposure part 14a of the electrode pad 14 is formed on the surface of projecting photosensitive resin 20 by a nonelectrolytic plating method or a sputtering method. |
