AN INTEGRATED CIRCUIT PACKAGE HAVING INTERCHIP BONDING AND METHOD THEREFOR

摘要

An integrated circuit package that has the ability for interdevice communication. The integrated circuit package has a first device mounted within the integrated circuit package. A second device is also mounted within the integrated circuit package. The second device is directly coupled to the first device through interdevice bonding for allowing the first device and the second device to communicate and control one another.