发明名称 |
Verfahren zum Trennen von Mikrobauelementen integrierter Schaltkreise |
摘要 |
A method of separating a plurality of micro-devices from one another which are formed in a predetermined pattern on a single substrate is disclosed herein. Each micro-device includes at least one predetermined area to be protected from process debris during the separating process. The method includes the step of first coating the micro-devices with a water soluble material such that at least the predetermined area is covered. Following coating, the micro-devices are separated from one another such that the water soluble material continues to cover the predetermined area. Next, the micro-devices and the water soluble material are exposed to water which substantially removes the water soluble material from the predetermined area without harming the micro-devices such that contamination of the predetermined area by the process debris is prevented during the separating step. |
申请公布号 |
DE19735041(C2) |
申请公布日期 |
1999.12.30 |
申请号 |
DE1997135041 |
申请日期 |
1997.08.13 |
申请人 |
NATIONAL SEMICONDUCTOR CORP., SANTA CLARA |
发明人 |
TAKIAR, HEM;MATHEW, RANJAN |
分类号 |
B81B7/00;B81C1/00;H01L21/301;H01L21/48;H01L21/50;(IPC1-7):H01L21/301;H01L21/312;H01L21/304 |
主分类号 |
B81B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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