| 摘要 |
<p>The present invention relates to the making of high density printed circuit boards with, inter alia, microvias. The method includes the steps of forming an inner core (40) having a circuit pattern (44) on at least one side thereof, applying resin (48) in liquid form to at least one side of core and pressing a prepreg (50) or resin coated conductor to the core (40).</p> |
