| 摘要 |
PROBLEM TO BE SOLVED: To enlarge the penetrating area for an abrasive material while suppressing reduction in mechanical strength, and prevent undulated deformation of an object to be lapped during lapping operation by a lapping device. SOLUTION: With the lapping carrier, a sun gear which is provided in the center of a surface plate, and gears 21 which are provided on the peripheral surface of the surface plate, concentrically with the sun gear to be engaged with an internal gear, are formed on the peripheral surface of the carrier body 22. Further, supporting holes 23 through which objects to be lapped can be inserted into the carrier body 22, and punched holes allowing an abrasive material to penetrate through, are provided. The thickness of the lapping carrier is 20 to 1000 μm. The remaining part of the carrier body 22 except the gears 21 and their peripheral edges, the supporting holes 23, are formed into a network 26, and the punched holes are meshes 27. The distance between the meshes 27 is 0.3 to 1.5 mm, and the shape of the mesh 27 is square or circular. The size of mesh 27 is 0.5 to 4 mm. |
