| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component mounter wherein deviation between an electronic component and an electronic component sucking nozzle when a flux is applied is corrected for precision mounting of the electronic component. SOLUTION: An electronic component mounter 10 is provided which comprises an electronic component sucking nozzle 18, a head part 20, an X-Y drive part 22, a flux applying device 24, an image recognizing device 26 capable of detecting the bump position of an electronic component 14, and an electronic component control part 30. An optical sensor (outline recognizing device) 28 is provided which, supported by the head part 20, is movable in X-Y direction together with the head part 20 and detects, before and after applying a flux, the side surface position of the electronic component 14 vacuum-sucked by the electronic component sucking nozzle 18. The control part 30 calculates dislocation of the electronic component when the flux is applied based on the side surface positions of the electronic component before and after the flux application while the dislocation can be corrected. |
