| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device that can reduce the size of a package, and at the same time can improve reliability in a test, and to provide a method for manufacturing the semiconductor device that can be tested without requiring any pins for external output. SOLUTION: An operation pad 31-1 on a base substrate 30 is electrically connected to a pin 32 on the back surface of the base substrate 30. Contrarily, a test pad 31-2 on the base substrate 30 is connected merely to a test pad 21-2 of a semiconductor chip 20, and is not connected to the pin for I/O with the outside. When the test is to be performed, the probe of a test device should be directly brought into contact with the test pad 31-2.</p> |
