发明名称 ADHESIVE COMPOSITION AND APPLICATION THEREOF
摘要 PROBLEM TO BE SOLVED: To provide an adhesive film/member improved in preservation stability while retaining its connection reliability and heat resistance. SOLUTION: The objective adhesive composition comprises an epoxy resin, an epoxy resin curing agent and an epoxy group-containing (meth)acrylic copolymer; wherein the epoxy group-containing (meth)acrylic copolymer has a glass transition temperature(Tg) of -50 to 30 deg.C, contains 0.5-2.7 wt.% of epoxy group- containing recurring unit and has a weight-average molecular weight of >=100,000.
申请公布号 JP2002275444(A) 申请公布日期 2002.09.25
申请号 JP20010078587 申请日期 2001.03.19
申请人 HITACHI CHEM CO LTD 发明人 SUZUKI MASAO;INADA TEIICHI;IWAKURA TETSUO
分类号 B32B7/10;B32B27/38;C08G59/20;C09J11/04;C09J133/14;C09J163/00;(IPC1-7):C09J163/00 主分类号 B32B7/10
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