| 摘要 |
PROBLEM TO BE SOLVED: To prevent the edge touch of a bonding wire without increasing a manufacture process by bringing the bonding wires which have highly possibility of being deformed at molding, and are connected from the vicinity of the center of a semiconductor element into touch with each other and connecting them. SOLUTION: A bonding pad formed near the center of a semiconductor element, which is a terminal for taking out the large current of a regular power source, is divided and a plurality of bonding pads 5-1 and 5-2 are formed in one terminal. At bonding of the pads 5-1 and 5-2 on the same land on a lead frame 1b, mutual loops are formed so that mutual bonding wires 6-1 and 6-2 cross each other. When sealing resin flows in at the time of molding, they can be supported with a force which is about twice that of the normal force, and the edge touch to the element 3 can be prevented even the wires 6-1 and 6-2 are bonded by the low loops. |
