| 摘要 |
PROBLEM TO BE SOLVED: To provide defect detecting method and device in a wire bonding device, which can detect the presence or the absence of occurrence of cracks in a semiconductor chip under a pad during the wire-bonding process in parralell in the wire bonding process. SOLUTION: This is a defect detecting method, which is applied on a wire- bonding device and detects the presence or the absence of defects in the wire bonding part. Under the state, a bonding wire 1 is connected to a pad 4, the electric conducting state between a heater block 7, on which a semiconductor chip 5 is mounted, and the bonding wire is detected. Thus, the presence or absence of cracks under the pad of the semiconductor chip 5 is detected. |
