发明名称 Heat-dissipating structure of backlight module
摘要 A backlight module and the heat-dissipating structure thereof are provided. An electrode sheath, with high thermal conductivity and electrical insulation, is arranged to hold the electrode of the lamp and to make a contact with the front bezel and the back bezel, which are made of high thermal-conductive material. Hence, the heat energy produced by the lamp will be conducted to the front band back bezels through the electrode sheath.
申请公布号 US7287895(B2) 申请公布日期 2007.10.30
申请号 US20050168672 申请日期 2005.06.28
申请人 AU OPTRONICS CORPORATION 发明人 LIN CHUN-YEN;LAI CHING-KUN
分类号 F21V7/04;F21V7/20;F21V29/00 主分类号 F21V7/04
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