发明名称 |
Method for chemically mechanically polishing organic film, method of manufacturing semiconductor device, and program therefor |
摘要 |
There is proposed a polishing method. The method includes feeding a slurry onto a polishing pad, press-contacting a semiconductor substrate held on a polishing head with the polishing pad, the semiconductor substrate having an organic film thereon, and chemically mechanically polishing the organic film by repeating a sequence of rotation and halt of rotation of the polishing pad and the polishing head.
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申请公布号 |
US7402521(B2) |
申请公布日期 |
2008.07.22 |
申请号 |
US20060418070 |
申请日期 |
2006.05.05 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
MATSUI YUKITERU;MINAMIHABA GAKU;SHIGETA ATSUSHI;YANO HIROYUKI |
分类号 |
H01L21/302;B24B37/10;H01L21/027;H01L21/304;H01L21/321;H01L21/768;H01L21/8242;H01L27/108 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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