METHOD OF MANUFACTURING SUBSTRATE FOR POWER MODULE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a substrate for power module that can prevent a brazing material from infiltrating.

SOLUTION: This method includes: a punching-out step wherein a metal base material is punched out and a metal layer 12A that is provided with curved-up sections 24 and 25 curved up as they approach the outer edge along the outer periphery and a circuit layer 13A are formed respectively; a groove formation step to form grooves 11a and 11b surrounding arrangement planned sections 11c and 11d along their outer edges where the metal layer 12A and the circuit layer 13A are arranged on the surface of a ceramics substrate 11; and a bonding step wherein the tip ends of the curved-up sections 24 and 25 are housed in the grooves 11a and 11b and an area surrounded by the groove 11a and the metal layer 12A are brazed in the ceramics substrate 11, and then an area surrounded by the groove 11b and the circuit layer 13A are brazed for bonding.

COPYRIGHT: (C)2009,JPO&INPIT