| 摘要 |
<p>A ceramic electronic component, a manufacturing method of a ceramic electronic component, and a packaging method of the ceramic electronic component are provided to mount a ceramic electronic component by determining the arrangement shape of conductor mounted in the chip. In a ceramic electronic component, a manufacturing method of a ceramic electronic component, and a packaging method of the ceramic electronic component, a conductor is arranged inside a chip body(2). External electrode(3,4) are formed in the first of the chip body and the second end side, and Identification layers(5,6) are formed on at least one side of the chip body. The chip body is formed into the first ceramics, and the identification layer is formed by a first ceramics and a second ceramic.</p> |
