发明名称 LIQUID THERMOSETTING RESIN COMPOSITION AND COPPER-CLAD LAMINATED PLATE USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a liquid thermosetting resin composition which contains an epoxy resin and a radically polymerizable compound, from which a thermoset product having high glass transition temperature (Tg) is obtained. Ž<P>SOLUTION: The liquid thermosetting resin composition contains the epoxy resin (A) having two or more epoxy groups in one molecule thereof, the crosslinking and radically polymerizable compound (B) containing 3-13 equivalents/kg unsaturated double bond, a styrene monomer (C), an imidazole-based compound and a radical polymerization initiator (E). Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010018778(A) 申请公布日期 2010.01.28
申请号 JP20090076115 申请日期 2009.03.26
申请人 PANASONIC ELECTRIC WORKS CO LTD 发明人 ABE TAKATOSHI;KASHIWABARA KEIKO;INOUE HIROHARU;UNO MINORU;ISHIKAWA TOMOYUKI
分类号 C08G59/40;H05K1/03 主分类号 C08G59/40
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