发明名称 |
SEMI-CONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF |
摘要 |
Disclosed is a semiconductor package which comprises: a board; at least one chip member mounted on the board; a molding unit stacked on the board to embed the chip member therein; and at least one inductor embedded in the molding unit to be arranged on an upper portion of the chip member. Therefore, the semiconductor package can be thin. |
申请公布号 |
KR20160066311(A) |
申请公布日期 |
2016.06.10 |
申请号 |
KR20140170523 |
申请日期 |
2014.12.02 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM, HYEONG TAEK;KIM, SE JONG |
分类号 |
H01L23/58;H01L23/28 |
主分类号 |
H01L23/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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